As early as August, we introduced the unique modification of the Nintendo Game Boy Advance SP, which replaced the back panel of the handheld computer with an extended version, which has enough internal capacity to upgrade the battery, Bluetooth audio transmitter, and support Qi wireless And USB-C charges. The disadvantage is that installing a 10 mm 3D printed “backpack” is not the most user-friendly operation.
But today we are happy to report that behind the so-called Dream Team THICC BOI SP Not only made some huge improvements to the module, But they plan to release it as a commercial kit in the next few months. The trick to make this considerable upgrade more forgiving is to use custom flat flexible cables, which allow users to easily solder all necessary test points and connections, as well as custom PCBs that integrate all required hardware together.
In the video below, [Tito] of Nacho Production Company Review the latest version of the mod he has been using [Kyle] with [Helder], And provides a complete step-by-step installation tutorial to let the audience understand what they will use once the kit goes on sale. Although it is still a fairly complex modification, the new design is surprisingly approachable. As we saw in previous console modifications, the use of flat flexible technology means that installation should not pose too much of a challenge for anyone with soldering experience.
Some people may delay because the replacement of the rear panel is even Thicker This time, I hope that the huge 4,500 mAh lithium polymer battery pack hidden in the modified unit can achieve unprecedented runtime, which will help relieve any discomfort (physical or other aspects) that you may bring about carrying a heavier case ). Even with power-consuming equipment such as an aftermarket IPS display and flash trolley, the new battery can keep your SP running for nearly 20 hours.If you haven’t hit Metroid: Zero Mission At that point, anyway, it’s time to take a break and reflect on your life.
according to [Tito]The logistical challenges and considerable upfront costs involved in the new rear panel injection molded in ABS are currently the main obstacles hindering the release of the kit. The current prototype seems to be 3D printed with resin, which completely does not match the look and feel of the original GBA SP shell and cannot be a viable option. Crowdfunding activities should allow them to overcome their initial dilemma, and as things move towards production, we will pay close attention to more updates.
The previous version of this module is impressive enough as a one-off project, but we are happy to see the team take the next step to make this compelling evolution of GBA more widely available. When you take advantage of all the tools in the arsenal of modern hardware hackers, this is a great example of what a small team or even an individual might achieve.