- A new rendering of Vivo X70 Pro Plus has appeared.
- These images detail the main features of the phone, including the huge quad camera hump and unique design.
Earlier this week, a rendering of the upcoming Vivo X70 Pro broke the cover. Now, there has been a set of new leaks and renderings related to Vivo X70 Pro Plus.
The details stem from Price barbara And reminder Steve Hemmerstoffer, and provide more insights on the core specifications and overall design of the phone.
Let’s talk about that design. On the front, Vivo X70 Pro Plus is equipped with a 6.7-inch large curved AMOLED display with a punch-hole camera. It seems reasonable not to consider the under-screen camera as a mobile phone series that prioritizes camera performance rather than aesthetics.
Speaking of this, a sizable camera hump can be seen in the back, showing three sensors on a vertical line, and another on the right side of the bottom lens. There is also a very obvious Zeiss brand on the back. In general, the hump is 2.3 mm thick, adding 9 mm to the already thick phone itself. It is said that the Vivo X70 Pro Plus is 164.8 mm long and 75.5 mm wide. Similar to the Xiaomi Mi 11 Ultra, the camera’s raised focus extends to the first third of the phone. However, there is no indication of the second screen.
The right side of the device contains a power button and a volume rocker, while the bottom contains a speaker grille and USB-C port.
The rendering did not reveal much in terms of specifications, but it is believed that this phone is equipped with a Snapdragon 888 SoC, at least 8GB of RAM and a full HD+ screen resolution.